Heat Seal Tape

Heat Seal Tape

Depending on the order, width and length can be produced in various ways.

Heat Seal테이프1
Heat Seal Tape


- No adhesive strength at room temperature but bonding force generates by heating
- It removes back grinding tape from wafer stably after grinding process of wafer
- As the consumption of this less compared to the conventional removing tape, this tape is very economical.


- Removal of wafer back grinding tape from wafer

Heat Seal테이프2