Features

Dicing tapes are sorted into FUD series of UV type and FND series of Non UV type depanding on tape's removal,
which secure wafer or substrates through high adhesive strength during sawing.
The adhesive strength of UV type becomes significantly reduced to facilitate die removal after UV irradiation.
- High adhesive strength based on an arclyic adhesive prevents fly-die, chipping and contamination by inflow of foreign substance.
- PO films has uniform and outstanding elongation and showing good performance in Pick and Place process.

Application

It provides an ideal solution to meet your stringent process requirements for wafer, glass, PCB, ceramic and so on.